solution for chemical polishing of 
wafers. The influence of etching solution composition on surface morphology was studied. The solutions investigated varied in 
(2.0–3.0 mol) and 
(0.0–5.0 mol) concentrations, but contained a constant concentration of tartaric acid (0.7 mol). It was found that the etchant has excellent polishing properties for 
wafers when the 
concentration was less than 1.5 mol. For 
concentration larger than 1.5, the etchant solution produced rough surfaces. The dependencies of the etching rate on solution composition, temperature, and etching time were studied.Source:IOPscience
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