Without any assumptions regarding residual impurity species in an undoped semiconductor, it is experimentally demonstrated that the densities and energy levels of impurities can be precisely determined by the graphical peak analysis method based on Hall-effect measurements, referred to as free carrier concentration spectroscopy (FCCS). Using p-type undoped GaSb epilayers grown by molecular beam epitaxy (MBE), the densities and energy levels of several acceptor species are accurately determined. Five acceptor species are detected in the undoped GaSb epilayers grown by MBE, while two are also found in p-type undoped GaSb wafers. A 21–41 meV acceptor and a 75–99 meV acceptor exist both in the epilayers and in the wafer. On the other hand, a 164–181 meV acceptor is detected in epilayers grown at an Sb4/Ga flux beam equivalent pressure ratio of 8 or 10, while a 259 meV acceptor is found in the epilayer grown at Sb4/Ga = 6. In addition, a very shallow acceptor, which is completely ionized at 80 K, is found in the epilayers. The densities of the very shallow acceptor and the 21–41 meV acceptor are minimum at Sb4/Ga = 8, which makes the hole concentration lowest in the temperature range of the measurement.
We report on the modeling, growth, processing, characterization and integration in a gas detection setup of side wall corrugated distributed feed-back antimonide diode lasers emitting at 2.28 and 2.67 μm. The laser structures were grown by molecular beam epitaxy on GaSb substrate. Ridge lasers were fabricated from the grown wafers according to the following process: a second order Bragg grating was defined on the sides of the ridges by interferometric lithography, optical lithography and etched in a Cl-based inductively coupled plasma reactor. The devices exhibit a power reaching 40 mW, a side mode suppression ratio better than 28 dB and a tuning range of 3 nm at room temperature. One of these devices was successfully integrated in a tunable diode laser absorption spectroscopy setup, thus demonstrating that they are suitable for gas analysis. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at email@example.com and firstname.lastname@example.org
The technical potential of room temperature bonding of wafers in vacuum using amorphous Si (a-Si) and Ge (a-Ge) films was studied. Transmission electron microscopy images revealed no interface corresponding to the original films surfaces for bonded a–Ge–a–Ge films. Analyses of film structure and the surface free energy at the bonded interface revealed higher bonding potential at the connected a–Ge–a–Ge interface than that of a–Si films. The electrical resistivity of a-Ge films is 0.62 Ωm, which is lower than that of a-Si film (4.7 Ωm), but 7–8 order higher than that of representative material films used for bonding in vacuum. Our results indicate that room temperature bonding using a–Ge films is useful to bond wafers without any marked influence on the electrical properties of devices on wafer surfaces caused by the electrical conductivity of films used for bonding. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at email@example.com and firstname.lastname@example.org
In this report, we present results of an experimental investigation of a near mid-gap trap energy level in InAs10 ML/GaSb10 ML type-II superlattices. Using thermal analysis of dark current, Fourier transform photoluminescence and low-frequency noise spectroscopy, we have examined several wafers and diodes with similar period design and the same macroscopic construction. All characterization techniques gave nearly the same value of about 140 meV independent of substrate type. Additionally, photoluminescence spectra show that the transition related to the trap centre is temperature independent. The presented methodology for thermal analysis of dark current characteristics should be useful to easily estimate the position of deep energy levels in superlattice photodiodes. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at email@example.com and firstname.lastname@example.org
The interfaces of InAs/GaSb superlattices (SLs) were studied with the goal of improving interband cascade infrared photodetectors (ICIPs) designed for the long-wavelength infrared region. Two ICIP structures with different SL interfaces were grown by molecular beam epitaxy, one with a ~1.2 monolayer (ML) InSb layer inserted intentionally only at the GaSb-on-InAs interfaces and another with a ~0.6 ML InSb layer inserted at both InAs-on-GaSb and GaSb-on-InAs interfaces. The material quality of the ICIP structures was similar according to characterization by differential interference contrast microscopy, atomic force microscopy, and x-ray diffraction. The performances of the ICIP devices were not substantially different despite the different interface structure. Both ICIPs had a peak detectivity of >3.7 × 1010 Jones at 78 K with a cutoff wavelength near 9.2 μm. The maximum operation temperatures of both ICIPs were as high as ~250 K, although the structures were not fully optimized. This suggests that the two interface arrangements may have a similar effect on structural, optical and electrical properties. Alternatively, the device performance of the ICIPs may be limited by mechanisms unrelated to the interfaces. In either case, the arrangement of dividing a thick continuous InSb layer at the GaSb-on-InAs interface into thinner InSb layers at both interfaces can be used to achieve strain balance in SL detectors for longer wavelengths. This suggests that with further improvements ICIPs should be able to operate at higher temperatures at even longer wavelengths. Source:IOPscience For more information, please visit our website: www.semiconductorwafers.net, send us email at email@example.com and firstname.lastname@example.org